发明名称 POSITIVE PHOTOSENSITIVE COMPOSITION AND PATTERN FORMING METHOD USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive photosensitive composition for use in the production process of a semiconductor such as IC, in the production of a circuit substrate of liquid crystal, thermal head and the like or in other photofabrication processes, the positive photosensitive composition being stable to environmental variation and having high sensitivity and high resolution, and to provide a pattern forming method using the same. <P>SOLUTION: The positive photosensitive composition contains (A) a compound having a group (a) of which the hydrophilicity is increased upon irradiation with an actinic ray or radiation and (B) a compound having a group (b) which is decomposed by the action of an alkali to increase solubility in an alkali developer and not having a group which is decomposed by the action of an acid, or contains (AB) a compound having the group (a) of which the hydrophilicity is increased upon irradiation with an actinic ray or radiation and the group (b) which is decomposed by the action of an alkali to increase solubility in an alkali developer and not having a group which is decomposed by the action of an acid. The pattern forming method using the same is also provided. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007192907(A) 申请公布日期 2007.08.02
申请号 JP20060008895 申请日期 2006.01.17
申请人 FUJIFILM CORP 发明人 KODAMA KUNIHIKO
分类号 G03F7/039;G03F7/004;H01L21/027 主分类号 G03F7/039
代理机构 代理人
主权项
地址