| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an exposure processing method and a manufacturing method of a semiconductor device capable of preventing detection accuracy of a surface position from lowering, even when a step difference on a substrate surface is large. <P>SOLUTION: When a photoresist applied on the surface of a wafer is subjected to scan exposure, surface position data of the wafer surface are acquired by scanning the surface of the wafer (step A1). Further, step difference information concerning the position and size of the step difference of the wafer surface is acquired from CAD data and film thickness design values or the like (step A2). Then, the surface position data are corrected on the basis of the acquired step difference information (step A3), and the surface position of the wafer surface is adjusted based on the corrected surface position data (step A4). Exposure processing is applied to the photoresist on the wafer surface adjusted in the surface position. <P>COPYRIGHT: (C)2007,JPO&INPIT |
