| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for heat conduction capable of improving heat conductivity of a hardened product. SOLUTION: The epoxy resin composition for heat conduction contains epoxy resin and an inorganic filler with higher heat conductivity than the epoxy resin, in which the epoxy resin is hardened by heating. Alkoxysilane graft epoxy resin is used for the epoxy resin. COPYRIGHT: (C)2007,JPO&INPIT
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