| 摘要 |
PROBLEM TO BE SOLVED: To deelectrify electric charge occurring when joining a cover glass to a wafer. SOLUTION: On the surface of the wafer 11 whereon an electronic circuit is formed, a spacer having a thickness of 100μm is formed. Then, the wafer 11 is placed on an XYθstage 20 and is aligned. After finishing the alignment of the wafer 11, an ionized air flow 32 is continuously blown against the wafer 11 from holes 33 of a nozzle 31 connected to a weak X-ray tube type deelectrification apparatus 30. The cover glass 12 is sucked to an upper-side table 25. Then, the XYθtable 20 whereon the wafer 11 is placed is raised to join the wafer 11 and the cover glass 12 together. Thereafter, the XYθstage 20 is lowered by 50μm. Electric charge which occurred when joining the wafer and the cover glass together is discharged from the upper-side table 25, so the destruction of the electronic circuit can be prevented on the wafer 11. COPYRIGHT: (C)2007,JPO&INPIT
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