| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a foreign substance sticking to the surface of a semiconductor substrate causes dropping of yield in a semiconductor manufacturing process. SOLUTION: A means is provided which radiates ultraviolet ray before discharging of liquid is completed after the time point just before discharging hydrofluoric acid solution. The means is attached to the upper part of the bath where the hydrofluoric acid is supplied. COPYRIGHT: (C)2007,JPO&INPIT
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