| 摘要 |
A stacked semiconductor chip assembly utilizing different bonding materials is disclosed. The assembly preferably includes a plurality of units being disposed one above the other, with each unit including at least a semiconductor chip and an interposer. Conductive joining elements are preferably disposed between adjacent units and between one unit and a circuit panel. At least some of the conductive joining elements have lower melting temperatures, than other units so as to allow mounting or rework by melting the lower-melting conductive joining elements while leaving the other conductive joining elements solid.
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