发明名称 |
Circuit board, semiconductor package having the same, and method of manufacturing the circuit board |
摘要 |
A circuit board may include an insulation plate having at least one slot. A first conductive pattern may be on the insulation plate. A plug may be on a sidewall of the slot, and may be electrically connected to the conductive pattern.
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申请公布号 |
US2007176279(A1) |
申请公布日期 |
2007.08.02 |
申请号 |
US20070654586 |
申请日期 |
2007.01.18 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM KIL-SOO |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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