发明名称 Circuit board, semiconductor package having the same, and method of manufacturing the circuit board
摘要 A circuit board may include an insulation plate having at least one slot. A first conductive pattern may be on the insulation plate. A plug may be on a sidewall of the slot, and may be electrically connected to the conductive pattern.
申请公布号 US2007176279(A1) 申请公布日期 2007.08.02
申请号 US20070654586 申请日期 2007.01.18
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM KIL-SOO
分类号 H01L23/48 主分类号 H01L23/48
代理机构 代理人
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