| 摘要 |
A method of packaging a semiconductor die ( 10 ) includes providing a flip-chip die ( 10 ) with bump connections ( 12 ) on its bottom surface ( 14 ). An adhesive tape ( 18 ) is attached to a plate surface ( 16 ) and lead fingers ( 20 ) are formed on the tape ( 18 ). The die ( 10 ) is placed on the tape ( 18 ) such that the bumps ( 12 ) on the die ( 10 ) contact respective ones of the lead fingers ( 20 ) on the tape ( 18 ). A reflow process is performed on the die ( 10 ), the tape ( 18 ) and the plate ( 16 ), which forms C5 type interconnects. A mold compound ( 24 ) is formed over the die ( 10 ) and the tape ( 18 ), and then the tape ( 18 ) and the plate ( 16 ) are removed.
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