| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a single chip, applied to a micro-array inertial device capable of facilitating a semiconductor back-end process for manufacturing the single chip, determined by factors such as mass and elastic coefficients, reducing the variations, and increasing the sensed signal. <P>SOLUTION: The single chip includes a plurality of sensing units arranged in an array form. Each of the plurality of sensing units is provided with a metal layer having a uniform thickness; a metal post, running vertically through the center point of the single chip and connecting to the metal layer, and making the metal layer swing relatively having two degrees of freedom due to the inertia; and an electrode layer, disposed in parallel with the side surface of the metal layer. The electrode layer is provided with a plurality of driving electrodes, a plurality of sense electrodes, and a blocking plate. <P>COPYRIGHT: (C)2007,JPO&INPIT |
