| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for precisely manufacturing a non-contact IC tag that will not damage IC chips. <P>SOLUTION: The method for manufacturing a non-contact IC tag comprises a process for fitting an intermediate sheet 10 formed with an opening 10a for IC chip fitting and an opening 10b for optical recognition to an inlet base 11A, in which an IC chip 3 is mounted on the end section of an antenna pattern 2, while monitoring the opening 10b for optical recognition and the antenna pattern 2 of the inlet base 11A, by positioning the IC chip 3 of the inlet base with the opening 10a for IC chip fitting, laminating the intermediate sheet 10, and laminating a surface protection sheet 4 on the surface of the antenna pattern 2 of the inlet base 11A; and a process for punching the outline of the non-contact ID tag 1 of a unit with a die cutter. <P>COPYRIGHT: (C)2007,JPO&INPIT |
