发明名称 |
Filtered electrical interconnect assembly |
摘要 |
An electronic module assembly for an implantable medical device includes a non-conductive block having an opening for accepting a feedthrough conductor. The block has opposite first and second ends and opposite first and second sides. A bond pad is located on the first end of the block for electrical connection to a feedthrough conductor, and the bond pad extends to the first side of the block to provide an electrical connection region there.
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申请公布号 |
US2007179551(A1) |
申请公布日期 |
2007.08.02 |
申请号 |
US20060343174 |
申请日期 |
2006.01.30 |
申请人 |
IYER RAJESH V;KNOWLES SHAWN D |
发明人 |
IYER RAJESH V.;KNOWLES SHAWN D. |
分类号 |
A61N1/00 |
主分类号 |
A61N1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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