发明名称 Filtered electrical interconnect assembly
摘要 An electronic module assembly for an implantable medical device includes a non-conductive block having an opening for accepting a feedthrough conductor. The block has opposite first and second ends and opposite first and second sides. A bond pad is located on the first end of the block for electrical connection to a feedthrough conductor, and the bond pad extends to the first side of the block to provide an electrical connection region there.
申请公布号 US2007179551(A1) 申请公布日期 2007.08.02
申请号 US20060343174 申请日期 2006.01.30
申请人 IYER RAJESH V;KNOWLES SHAWN D 发明人 IYER RAJESH V.;KNOWLES SHAWN D.
分类号 A61N1/00 主分类号 A61N1/00
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