HEAT DISSIPATING MEMBER AND SEMICONDUCTOR DEVICE USING SAME

摘要

Disclosed is a heat dissipating member which is interposed between a heat-generating electronic component and a heat dissipating body. This heat dissipating member contains (A) 100 parts by weight of an addition-curable silicone gel having a penetration of not less than 100 (according to ASTM D 1403), and (B) 500-2000 parts by weight of a heat conductive filler. Also disclosed is a semiconductor device comprising a heat-generating electronic component and a heat dissipating body, wherein a heat dissipating member is interposed between the heat-generating electronic component and the heat dissipating body.