| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device of which cutting of a conductor layer is surely prevented. SOLUTION: A semiconductor device 1 comprises a substrate 3, a semiconductor element 4 mounted on the substrate 3, and a joint 5 containing a metal for connecting the substrate 3 to the semiconductor element 4. The substrate 3 has an insulating layer 311 containing resin and a conductor wiring layer 312 laminated alternately. The conductor wiring layers 312 are connected by a conductor layer 313 formed in a via hole 311A of the insulating layer 311.α<SB>2Z</SB>(Tm-Tg) equals to 0.1×10<SP>-2</SP>to 1.8×10<SP>-2</SP>, where the linear expansion factor in thickness direction of the substrate 3 at a temperature T2 higher than the glass transition point (Tg) of the substrate 3 isα<SB>2Z</SB>, melting point of the joint part 5 is Tm, and the glass transition point of the substrate 3 is Tg. COPYRIGHT: (C)2007,JPO&INPIT |
