发明名称 FLEXIBLE PRINTED WIRING BOARD, AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a flexible printed wiring board which is superior in adhesion property of a resin substrate and metal wiring. SOLUTION: The printed wiring board has the resin substrate having a fine concave and convex surface, a base layer formed on the fine concave and convex surface, a seed layer formed on the base layer in a pattern shape and a wiring plating layer formed on the seed layer. The base layer comprises a metal for adhesion property improvement. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007194265(A) 申请公布日期 2007.08.02
申请号 JP20060008808 申请日期 2006.01.17
申请人 DAINIPPON PRINTING CO LTD 发明人 MIURA YOICHI;NARITA YUJI
分类号 H05K1/09;H05K3/18;H05K3/38 主分类号 H05K1/09
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