发明名称 |
FLEXIBLE PRINTED WIRING BOARD, AND ITS MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a flexible printed wiring board which is superior in adhesion property of a resin substrate and metal wiring. SOLUTION: The printed wiring board has the resin substrate having a fine concave and convex surface, a base layer formed on the fine concave and convex surface, a seed layer formed on the base layer in a pattern shape and a wiring plating layer formed on the seed layer. The base layer comprises a metal for adhesion property improvement. COPYRIGHT: (C)2007,JPO&INPIT
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申请公布号 |
JP2007194265(A) |
申请公布日期 |
2007.08.02 |
申请号 |
JP20060008808 |
申请日期 |
2006.01.17 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
MIURA YOICHI;NARITA YUJI |
分类号 |
H05K1/09;H05K3/18;H05K3/38 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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