发明名称 |
Apparatus having heating portion in chemical bath for substrate wet treatment and method of heating chemical for substrate wet treatment using the apparatus |
摘要 |
There are provided an apparatus having a heating portion in a chemical bath for substrate wet treatment and a method of heating a chemical for substrate wet treatment using the apparatus. The apparatus includes a chemical bath containing a chemical for substrate wet treatment. A heating portion is installed in the chemical bath, and the heating portion includes a heating element and a housing accommodating the heating element. An inert gas is filled in the housing.
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申请公布号 |
US2007175497(A1) |
申请公布日期 |
2007.08.02 |
申请号 |
US20060638003 |
申请日期 |
2006.12.13 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE BYEONG-CHU;HEO DONG-CHUL;CHO MO-HYUN |
分类号 |
B08B7/04;B08B3/00 |
主分类号 |
B08B7/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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