发明名称 Apparatus having heating portion in chemical bath for substrate wet treatment and method of heating chemical for substrate wet treatment using the apparatus
摘要 There are provided an apparatus having a heating portion in a chemical bath for substrate wet treatment and a method of heating a chemical for substrate wet treatment using the apparatus. The apparatus includes a chemical bath containing a chemical for substrate wet treatment. A heating portion is installed in the chemical bath, and the heating portion includes a heating element and a housing accommodating the heating element. An inert gas is filled in the housing.
申请公布号 US2007175497(A1) 申请公布日期 2007.08.02
申请号 US20060638003 申请日期 2006.12.13
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE BYEONG-CHU;HEO DONG-CHUL;CHO MO-HYUN
分类号 B08B7/04;B08B3/00 主分类号 B08B7/04
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