SEMICONDUCTOR MANUFACTURING APPARATUS

摘要

A semiconductor manufacturing apparatus is provided to support sufficiently a semiconductor substrate without the deformation of the substrate due to the repulsive force of a holder loading port under high temperature conditions by making peripheral portions of front and rear surfaces of the substrate supported through a support panel. A ring type holder has a center opening portion for performing a heat treatment on a semiconductor substrate. A ring type support panel is loaded on the holder through a first loading port of the holder to contact a peripheral portion of a rear surface of the substrate. A pair of susceptors(18) are used for loading the substrate from front and rear sides of the substrate through the holder loaded through a susceptor loading port. At this time, each susceptor includes the holder and the support panel, so that the substrate is supported from front and rear sides. The susceptors are loaded into a reaction chamber(24) from a boat(22) by using a pair of support rollers. A driving apparatus(26) is connected to the driving roller from an outer portion of the reaction chamber, wherein the driving roller is one out of the pair of the support roller.