| 摘要 |
PROBLEM TO BE SOLVED: To provide a high frequency package for suppressing the deterioration of an IC high frequency characteristic to be caused by the resonance of power feeding lines. SOLUTION: A substrate includes a ground conductive layer 3 between first and second dielectric layers 1a, 1b. The second power feeding line 7b formed on the surface 1b of the second dielectric layer is electrically connected to the first power feeding line 7a formed on the surface 1a of the first dielectric layer via a via hole 6b. A lossy material 10 is arranged inside the first dielectric layer 1a so as to enclose the via hole 6b. COPYRIGHT: (C)2007,JPO&INPIT |
