发明名称 PRINTED CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME
摘要 A printed circuit board assembly has plural printed circuit boards that are mechanically and electrically connected to each other with them being stacked, and a connection layer that connects the adjacent two printed circuit boards to each other is provided. The connection layer includes an insulation portion and an electric conduction portion. The insulation portion contains an insulating member and is adhered to each of the adjacent two printed circuit boards. The electric conduction portion passes through the insulation portion and connects electrode terminals of the adjacent two printed circuit boards.
申请公布号 US2007176613(A1) 申请公布日期 2007.08.02
申请号 US20070627844 申请日期 2007.01.26
申请人 SONY CORPORATION 发明人 OGAWA MINORU;NISHIMOTO KAZUTO
分类号 G01R31/02 主分类号 G01R31/02
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