发明名称 |
Polishing pad and method for manufacture of semiconductor device using the same |
摘要 |
The present invention provides a polishing pad which imparts excellent planarity and uniformity thereof to a material to be polished, such as a semiconductor wafer, without forming scratches. The present invention relates to a semiconductor wafer polishing pad comprising a polishing layer and a cushion layer, wherein the polishing layer is formed from foamed polyurethane, has a flexural modulus of 250 to 350 MPa, the cushion layer is formed from closed-cell foam and has a thickness of 0.5 to 1.0 mm and a strain constant of 0.01 to 0.08 mum/(gf/cm<SUP>2</SUP>). |
申请公布号 |
US2007178812(A1) |
申请公布日期 |
2007.08.02 |
申请号 |
US20050590067 |
申请日期 |
2005.02.22 |
申请人 |
TOYO TIRE & RUBBER CO., LTD. |
发明人 |
SHIMOMURA TETSUO;KAZUNO ATSUSHI;OGAWA KAZUYUKI;NAKAI YOSHIYUKII;NAKAMORI MASAHIKO;YAMADA TAKATOSHI |
分类号 |
B24B7/30;B24B37/00;B24B37/04;B24B37/20;B24B37/24;B24D13/14;H01L21/304 |
主分类号 |
B24B7/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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