发明名称 LIGHT EMITTING MODULE, METHOD FOR FABRICATION THEREOF, AND INDICATOR USING THE LIGHT EMITTING MODULE
摘要 <P>PROBLEM TO BE SOLVED: To solve a problem that brightness and luminous efficiency are lowered by heat generation in light emitting devices owing to shadow influences among light emitting devices, which is increased as the mounting density of the light emitting elements increases. <P>SOLUTION: Plural light emitting devices 104 are slanted to prevent their sides from facing each other so that radiation light from the sides of other light emitting devices 104 can be used effectively. In addition, these devices 104 are mounted on a lead frame 100 so that the side of the lead frame 100 can be used as a reflecting plate for radiation light of the light emitting devices 104; and the lead frame 100 including this side can be used for heat dissipation and current supply, in order to release the heat generated in the light emitting devices 104 to the metal plate 108 of the rear through a heat dissipation resin layer 106 as well as the lead frame 100. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007194610(A) 申请公布日期 2007.08.02
申请号 JP20060342167 申请日期 2006.12.20
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TSUMURA TETSUYA;TSUJIMOTO ETSUO;NISHIYAMA KIMIHARU;NAKAO KEIICHI
分类号 H01L33/60;G02F1/13357;H01L33/62;H01L33/64 主分类号 H01L33/60
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