| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic circuit module in which a semiconductor element and a peripheral circuit component can be connected without using an interposer substrate, and to provide a method of manufacturing the same. <P>SOLUTION: The electronic circuit module 3 includes a semiconductor component 1 which has a plurality of external terminals 11 at a peripheral edge of a package body containing a semiconductor chip 15, and a circuit component 2 which is mounted on the semiconductor component 1 and electrically connected to the external terminals 11. The circuit component 2 is electrically connected to the external terminals 11 of the semiconductor component 1, and then electric continuity is obtained between the semiconductor component 1 and the circuit component 2. Consequently, the electronic circuit module 3 can be constituted without requiring any interposer substrate, so the components can be made inexpensive. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
