| 摘要 |
PROBLEM TO BE SOLVED: To suppress voids generated under the bonding condition in which bonding strength is high. SOLUTION: The bonded substrate having higher bonding strength can be obtained by bonding substrates within a chamber 1100 in the atmosphere including hydrogen or helium and water after at least any of the substrates is processed to have hydrophilic property. Since voids generated in the bonding process are formed of hydrogen, such voids may be removed with diffusion through the subsequent heat treatment. COPYRIGHT: (C)2007,JPO&INPIT
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