| 摘要 |
<P>PROBLEM TO BE SOLVED: To keep a conductive adhesive applied on the undersurfaces of LEDs uniform in thickness so as to satisfy requirements, such as a density enhancement and an improvement in heat dissipation properties, for LEDs mounted on a sub-mount, and to prevent an electrical short circuit from occurring between interconnections due to the fact that the conductive adhesive spreads too wide. <P>SOLUTION: Columnar bumps having each a smooth outer shape are provided at the periphery of a die bonding region on a sub-mount, so that the thickness and wetting spread of the conductive adhesive can be controlled when a die bonding process is carried out. <P>COPYRIGHT: (C)2007,JPO&INPIT |
