| 摘要 |
PROBLEM TO BE SOLVED: To provide a composite electronic component, a wireless circuit module, and a method of manufacturing the composite electronic component which can downsize a module and a substrate by narrowing a mounting area of the substrate. SOLUTION: The composite electronic component includes a substrate 11 including a dielectric, a conductive film 12 formed on the surface of the substrate 11, a conductive film 13 which is formed on a part of the surface of the conductive film and has resistivity different from that of the conductive film 12, and a pair of electrodes 16 formed on the conductive film 12 and the conductive film 13, respectively. One conductive film having lower resistivity out of the conductive films 12 and 13 is formed helically and functions as at least a coil, and the other having higher resistivity out of the conductive films 12 and 13 functions as at least a resistance. COPYRIGHT: (C)2007,JPO&INPIT
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