TEST PATTERN WAFER FOR DEFECT INSPECTING DEVICE, ITS MANUFACTURING METHOD, AND EVALUATION METHOD OF DEFECT INSPECTION APPARATUS USING IT

摘要

PROBLEM TO BE SOLVED: To make proper inspection conditions of an electron-beam semiconductor wafer inspection apparatus. SOLUTION: Inspection conditions of an inspection apparatus are made proper by creating a sample where a nonconductive contact hole 2 on a wafer through defect position and size thereof, and the thickness of a defect layer are clear, and by evaluating the sample. COPYRIGHT: (C)2007,JPO&INPIT