| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical pickup structure that can secure the heat dissipation in the semiconductor laser driver IC. SOLUTION: In the optical pickup, a space is formed between the electronic circuit board 2 and the optical pickup case 4, and the laser driver IC 3 which controls the light emission of the semiconductor laser is mounted on the electronic circuit board close to the optical pickup case. COPYRIGHT: (C)2007,JPO&INPIT
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