发明名称 LASER CUTTING UNIT AND CUTTING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser cutting unit enhancing machining accuracy. <P>SOLUTION: This laser cutting unit 10 is equipped with a support mechanism 20 which supports a material 7 to be processed, and a machining mechanism 40 which irradiates a laser beam 41a and locally heat the supported material 7 to be processed on the support mechanism 20 and supplies a coolant 46 such as water and locally cool it. The support mechanism 20 curves the material 7 to be processed to protrude the assumed predetermined cutting line 7a of the material 7 to be processed. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007191363(A) 申请公布日期 2007.08.02
申请号 JP20060012349 申请日期 2006.01.20
申请人 TOSHIBA CORP;SHIBAURA MECHATRONICS CORP 发明人 YAHAGI SUSUMU;OE ATSUSHI;HAYASHI MASAKAZU
分类号 C03B33/09;B23K26/10;B23K26/38;B23K26/40;B28D5/00 主分类号 C03B33/09
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