发明名称 |
LASER CUTTING UNIT AND CUTTING METHOD |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser cutting unit enhancing machining accuracy. <P>SOLUTION: This laser cutting unit 10 is equipped with a support mechanism 20 which supports a material 7 to be processed, and a machining mechanism 40 which irradiates a laser beam 41a and locally heat the supported material 7 to be processed on the support mechanism 20 and supplies a coolant 46 such as water and locally cool it. The support mechanism 20 curves the material 7 to be processed to protrude the assumed predetermined cutting line 7a of the material 7 to be processed. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
申请公布号 |
JP2007191363(A) |
申请公布日期 |
2007.08.02 |
申请号 |
JP20060012349 |
申请日期 |
2006.01.20 |
申请人 |
TOSHIBA CORP;SHIBAURA MECHATRONICS CORP |
发明人 |
YAHAGI SUSUMU;OE ATSUSHI;HAYASHI MASAKAZU |
分类号 |
C03B33/09;B23K26/10;B23K26/38;B23K26/40;B28D5/00 |
主分类号 |
C03B33/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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