发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a technique capable of reducing a chip size. SOLUTION: Wiring outside a cell extending on a macro cell MC3 in an X direction is constituted using an upper wiring layer rather than a terminal Ts for the signal of the macro cell MC3. The terminal Ts is constituted such that it is extended in a Y direction (a direction crossing the X direction) such that it is secured for the plurality of channels of the wiring outside the cell. Connection between the macro cell MC3 and the wiring outside the cell is carried out via the terminal Ts for the signal. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007194640(A) 申请公布日期 2007.08.02
申请号 JP20070011041 申请日期 2007.01.22
申请人 RENESAS TECHNOLOGY CORP 发明人 YAMADA TOSHIO;YANAGISAWA KAZUMASA;SHINOZAKI YOSHIHIRO;AOYANAGI HIDETOMO
分类号 H01L21/82;H01L21/822;H01L27/04;H03K19/00 主分类号 H01L21/82
代理机构 代理人
主权项
地址