| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED package using a compound semiconductor light emitting element, capable of reducing nonuniformity in light emission strength on a light emission surface and efficiently taking out the light emission to an outer part. <P>SOLUTION: The LED package is manufactured by mounting a semiconductor light emitting element on a recess with smooth side surfaces and a flat bottom surface, and sealing the recess with a translucent resin. The area of a metallic lead on the bottom surface of the recess is within the range of 3%-50% with respect to the whole bottom surface. <P>COPYRIGHT: (C)2007,JPO&INPIT |
