| 摘要 |
In a method of testing a semiconductor wafer, semiconductor chips of a predetermined number are selected from among a plurality of semiconductor chips formed on a semiconductor wafer, and a first test is performed on I/O pins of each of the selected semiconductor chips. Then, a second test is performed on a part of the I/O pins of each of non-selected semiconductor chips as ones of the plurality of semiconductor chips other than the selected semiconductor chips.
|
