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发明名称
Herstellungsverfahren für gebondetes Substrat
摘要
申请公布号
DE60220736(D1)
申请公布日期
2007.08.02
申请号
DE20026020736
申请日期
2002.04.02
申请人
HEWLETT-PACKARD CO. (N.D.GES.D.STAATES DELAWARE)
发明人
LEE, HEON;YANG, CHUNG CHING
分类号
H01L21/02;H01L21/762;B81C99/00;H01L21/18;H01L21/20
主分类号
H01L21/02
代理机构
代理人
主权项
地址
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