摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which can give a cured film having good insulation properties, chemical resistance, and a low shrinkage stress in heat treatment. SOLUTION: The thermosetting resin composition comprises (a) a resin having at least one type of structural units selected from three types of structural units represented by formulas including formula (1) and (b) a thermal crosslinking agent. In formula (1), R<SP>1</SP>and R<SP>3</SP>are each a 4 to 14-valent organic group; R<SP>2</SP>, R<SP>4</SP>, R<SP>5</SP>, and R<SP>6</SP>are each a 2 to 12-valent organic group; Xs are each independently a 3 to 50C organic group; Z and A are each NH, O, S, CO, PO, or Si(CH<SB>3</SB>)<SB>2</SB>; m, n, and p are each in the range of 1 to 10,000; and α and β are each an integer of 0 to 10, provided that α+β equals to an integer of 1 to 10. COPYRIGHT: (C)2007,JPO&INPIT
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