| 摘要 |
PROBLEM TO BE SOLVED: To provide a device and a method for cleaning a wafer in which a variety of wafers can be cleaned surely without using a variety of brushes. SOLUTION: A wafer 21 completed CMP processing is rotated. A surface cleaning brush 3a and a backside cleaning brush 3b are then brought into contact with the opposite sides of the wafer 21 while rotating. After the surface cleaning brush 3a and the backside cleaning brush 3b are brought into contact with the wafer 21, opposite ends of the surface cleaning brush 3a and the backside cleaning brush 3b are pressed by a pressing portion 1 thus deforming the opposite end portions of the brushes 3a and 3b. More specifically, the opposite end portions of the surface cleaning brush 3a and the backside cleaning brush 3b are compressed to enlarge the diameter at the opposite end portions. As a result, entire surface of the wafer 21 touches the surface cleaning brush 3a substantially uniformly even if the wafer 21 is warped angularly, and cleaning efficiency at the outer circumferential portion of the wafer 21 is enhanced. COPYRIGHT: (C)2007,JPO&INPIT
|
