| 摘要 |
PROBLEM TO BE SOLVED: To provide electrically conductive particles provided with low temperature sinterability equal to that of a solder powder, a tin powder or the like, and in which conductor resistance upon conductor formation is reduced as much as possible. SOLUTION: For solving the above problem, a tin-coated silver powder in which the surface of each silver particle is provided with a tin-coated layer is adopted, and proper conditions such as the quantity of the tin to be coated are decided. Then, for obtaining the tin-coated silver powder, e.g., a method where the surface of each silver particle is temporarily provided with a copper layer to produce a copper-coated silver powder, and the copper-coated layer in the copper-coated silver powder is substituted for a tin layer, so as to form a tin-coated layer on the surface of each particle is adopted. COPYRIGHT: (C)2007,JPO&INPIT
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