| 摘要 |
Disclosed herein is a printed circuit board that allows a wiring pattern to be resistant to noise while maintaining solderability even in the case where a wiring pattern is drawn out from the lower part of a QFP. A printed circuit board on which a QFP is mounted by dip soldering is provided with two separate solder flow lands formed between a front soldering land group and a rear soldering land group and a wiring pattern formed between the two separate solder flow lands, wherein the wiring pattern is a land having a width of not less than 0.3 mm, and a space between the wiring pattern and the solder flow lands is not less than 0.4 mm nor more than 0.8 mm.
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