SOLDER DEPOSITION AND THERMAL PROCESSING OF THIN-DIE THERMAL INTERFACE MATERIAL

摘要

Solder is deposited on a heat sink. The solder is first ref lowed at a first temperature that is below about 120° C. The solder is then heat aged at a second temperature that causes the first reflowed solder to have an increased second ref low temperature. The heat aging process results in less compressive stress in a die that uses the solder as a thermal interface material. The solder can have a composition that reflows and adheres to the die and the heat sink without the use of organic fluxes.