| 摘要 |
A surface mount optical semiconductor device and circuit can efficiently transfer and dissipate heat even when being mounted together with electronic circuit components. The optical semiconductor device can include a lead frame having a concave portion for mounting a light-emitting element therein and a pair of electrode terminals connected to a board. A sealing resin portion can be provided for sealing a surrounding region of the concave portion. A bottom surface of the concave portion is located at a predetermined distance from a connecting surface on which the pair of electrode terminals is connected to the board. The bottom surface of the concave portion can also be exposed from a bottom surface of the sealing resin portion. Thus, the bottom surface of the concave portion and the device in general can be air-cooled efficiently. |
