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发明名称
多层印刷电路板及其制造方法
摘要
一种印刷电路板包含有一产品部分与一支持板,该支持板的上与下表面系涂布有具有不同材料特性之焊锡遮罩。
申请公布号
TW200730060
申请公布日期
2007.08.01
申请号
TW095129198
申请日期
2006.08.09
申请人
富士通股份有限公司
发明人
伊东伸孝
分类号
H05K3/46(2006.01)
主分类号
H05K3/46(2006.01)
代理机构
代理人
恽轶群;陈文郎
主权项
地址
日本
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