发明名称 SPUTTERING TARGET BACKING PLATE ASSEMBLY AND FILM DEPOSITION SYSTEM
摘要 Provided is a tabular sputtering target on which an erosion portion and a non-erosion portion are formed, and the surface area thereof exceeds 100% but is less than 125% of the surface area when the target is assumed to be planar. Also provided is a tabular sputtering target on which an erosion portion and a non-erosion portion are formed comprising one or more concave portions on the target surface region, and the surface area thereof exceeds 100% but is less than 125% of the surface area when the target is assumed to be planar. An inexpensive, small-capacity power supply unit can be used by minimizing the electrical variations in the sputtering circuit as much as possible throughout the lifespan of the target through self sputtering or high power sputtering.
申请公布号 EP1813693(A1) 申请公布日期 2007.08.01
申请号 EP20050793199 申请日期 2005.10.14
申请人 NIKKO MATERIALS COMPANY, LIMITED 发明人 MIYASHITA, HIROHITO
分类号 C23C14/34;H01J37/34 主分类号 C23C14/34
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