Light emitting diode packaging structure

摘要

A light emitting diode (LED) packaging structure includes a package body (202), a lead frame (212) and a reflective wall (214). The package body includes a chip accommodating space (204) for an LED chip, and a portion of the lead frame is exposed to the chip accommodating space. The reflective wall (214) is connected with the lead frame (212) and extendedly bends from the lead frame (212) to cover a sidewall of the accommodating space so that rays of the LED chip can reflect from the reflective wall (214) mostly.