STACK PACKAGE HAVING LEADFRAME SOCKET

摘要

A stacked package is provided to stack easily semiconductor chip packages with each other without the warpage of semiconductor chip package by using a lead frame socket capable of inserting the semiconductor chip package. A stacked package includes a plurality of semiconductor chip packages. Each semiconductor chip package(111) includes a semiconductor chip(131) mounted on one surface of a substrate(135) and external connection terminals formed on the other surface. The stacked package further includes a lead frame socket. The lead frame socket(150) is used for inserting the semiconductor chip package. The lead frame socket is composed of socket inner leads(151) corresponding to the external connection terminals, socket outer leads(153) vertical to the socket inner leads, and a support part(155) for fixing the socket inner leads.