SPIN HEAD AND METHOD FOR HOLDING/UNHOLDING WAFER USING THE SAME

摘要

A spin head and a wafer holding/unholding method using the same are provided to remove chemicals from a wafer contact surface, to perform uniformly a predetermined treatment on the entire surface of a wafer and to minimize the generation of process fails on the wafer contact surface. A spin head includes a plate, first and second holding pins and a driving unit. The first and second holding pins(120a,140a) are arranged along an upper peripheral portion of the plate to prevent a substrate from being deviated from the plate. The driving unit is used for holding/unholding the substrate by making the first and second holding pins contact/non-contact alternately a side of the substrate. The driving unit is composed of first driven parts(200) for rotating the first holding pin, second driven parts(300) for rotating the second holding pin and a driving part(400) for driving the first and second driven parts.