PBGA PACKAGE TYPE PRINTED CIRCUIT BOARD HAVING VIA THAT IS FORMED INSIDE ENCAPSULATION AREA AND PBGA PACKAGE USING THE SAME

摘要

A PCB(Printed Circuit Board) and a PBGA(Plastic Ball Grid Array) using the same are provided to prevent the generation of a cut portion between a circuit line pattern and a ball land in spite of the generation of delamination between the PCB and a resin sealing part using a via formed at an inner side of the resin sealing part. A PCB includes a chip mounting region(10) for mounting a semiconductor chip, a circuit line pattern(20) around the chip mounting region, a resin sealing region(50) at an upper portion, a plurality of ball lands for contacting the circuit line pattern at a lower portion, and a via. The via(30) is used for supplying an electrical connection path between the circuit line pattern and the ball land. The via is formed at an inner side of the resin sealing region.