发明名称 |
APPARATUS FOR ALIGNING AND DISPENSING SOLDER COLUMNS IN AN ARRAY |
摘要 |
AN APPARATUS FOR ALIGNING AND DISPENSING (10) A PLURALITY OF SOLDER COLUMNS (18) IN AN ARRAY.THE APPARATUS INCLUDES A VIBRATOR (12) AND AN ELONGATED ALIGNMENT PLATE (14) SUPPORTED ON THE VIBRATOR (12). THE ALIGNMENT PLATE (14) INCLUDES A PLURALITY OF LONGITUDINAL GUIDE GROOVES (26). A TRANSPARENT COVER IS SECURED ON THE ALIGNMENT PLATE (14) AND SHAPED TO COVER PART OF THE GUIDE GROOVES (26). A PARTS FEEDER IS OPERATIVELY ASSOCIATED WITH THE ALIGNMENT PLATE (14) TO FEED SOLDER COLUMNS (18) OVER THE UPSTREAM END (14A) OF THE ALIGNMENT PLATE (14). THE SOLDER COLUMNS (18) ARE RECEIVED IN THE GUIDE GROOVES (26) AND FED TOWARD THE DOWNSTREAM END (14B) OF THE ALIGNMENT PLATE WHILE THE ALIGNMENT PLATE (14) IS VIBRATED BY THE VIBRATOR (12). THE SOLDER COLUMNS (18) ARE ARRANGED IN AN ARRAY WITHIN THE GUIDE GROOVES (26) SO THAT A VACUUM PICKUP TOOL MAY READILY CAPTURE THE CYLINDRICAL BODY OF THE SOLDER COLUMNS (18).(FIG 1)
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申请公布号 |
MY130888(A) |
申请公布日期 |
2007.07.31 |
申请号 |
MYPI20034828 |
申请日期 |
2003.12.16 |
申请人 |
SENJU METAL INDUSTRY CO., LTD* |
发明人 |
SHINICHI NOMOTO;TAKASHI NAUCHI |
分类号 |
B23K1/00;H01L23/12;B23K3/06;H01L21/00;H01L21/48;H01L23/28;H05K3/34 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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