发明名称 APPARATUS OF SUPPORTING A WAFER HAVING KNIFE EDGE RING
摘要 A wafer supporting apparatus having a knife edge ring is provided to maintain the fastening force of a level adjusting bolt for adjusting a level of the knife edge ring which is positioned on an inner cup. A wafer(21) is loaded on a chuck(23), and a sidewall of the chuck is surrounded by an inner cup(31). A knife edge ring(33) is disposed on an upper portion of the inner cup to surround the sidewall of the chuck, and has a first through-hole(33a). A first level adjusting bolt is fastened to the first through-hole, and an end portion of the first level adjusting bolt contacts the upper surface of the inner cup. A second level adjusting bolt is fastened to the first through-hole, and is positioned on the first level adjust bolt.
申请公布号 KR20070078346(A) 申请公布日期 2007.07.31
申请号 KR20060008584 申请日期 2006.01.26
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, SE HOON;CHOI, DUG KYU
分类号 H01L21/68 主分类号 H01L21/68
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