发明名称 |
APPARATUS OF SUPPORTING A WAFER HAVING KNIFE EDGE RING |
摘要 |
A wafer supporting apparatus having a knife edge ring is provided to maintain the fastening force of a level adjusting bolt for adjusting a level of the knife edge ring which is positioned on an inner cup. A wafer(21) is loaded on a chuck(23), and a sidewall of the chuck is surrounded by an inner cup(31). A knife edge ring(33) is disposed on an upper portion of the inner cup to surround the sidewall of the chuck, and has a first through-hole(33a). A first level adjusting bolt is fastened to the first through-hole, and an end portion of the first level adjusting bolt contacts the upper surface of the inner cup. A second level adjusting bolt is fastened to the first through-hole, and is positioned on the first level adjust bolt.
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申请公布号 |
KR20070078346(A) |
申请公布日期 |
2007.07.31 |
申请号 |
KR20060008584 |
申请日期 |
2006.01.26 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, SE HOON;CHOI, DUG KYU |
分类号 |
H01L21/68 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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