APPARATUS AND METHOD FOR DIE ATTACHMENT.

摘要

THE INVENTION PROVIDES AN APPARATUS FOR DIE (10) ATTACHMENT ONTO A SUBSTRATE (16) INCLUDING NON-METALLIC MATERIAL, AND METALLIC MATERIAL (13) THAT IS ADAPTED TO RECEIVE A DIE HAVING A EUTECTIC COATING. A HEATING CONDUIT IS PROVIDED THROUGH WHICH THE SUBSTRATE (16) IS MOVABLE FOR HEATING THE METALLIC MATERIAL TO A EUTECTIC BONDING TEMPERATURE TO FACILITATE BONDING BETWEEN THE DIE (10) AND THE METALLIC MATERIAL (13) AT A DIE-ATTACH POSITION.AN INDUCTION HEATING DEVICE AT THE DIEATTACH POSITION.AN INDUCTION HEATING DEVICE AT THE DIE-ATTACH POSITION HEATS THE METALLIC MATERIAL OF THE SUBSTRATE (16) TO THE EUTECTIC BONDING TEMPERATURE PRIOR TO ATTACHING A ONTO THE METALLIC MATERIAL.(FIG 5)