发明名称 COOLING APPARATUS HAVING AUXILIARY CHILLER AND SEMICONDUCTOR FABRICATING METHOD USING THE SAME
摘要 A cooling apparatus and a method for manufacturing a semiconductor device using the same are provided to keep uniformly the temperature of a wafer chuck in an aiming range by cooling additionally the wafer chuck in case of an abnormal temperature state of the wafer chuck using an auxiliary chiller. A cooling apparatus includes a support unit, a main chiller, a coolant passages and an auxiliary chiller. The support unit is used for loading stably a wafer. The support unit has a cooling room. The main chiller(30) is spaced apart from the support unit. The main chiller includes a main coolant room. The coolant passages are used for connecting the cooling room and the main coolant room with each other. The auxiliary chiller(84) is capable of attaching/detaching to/from the coolant passages.
申请公布号 KR100746231(B1) 申请公布日期 2007.07.30
申请号 KR20060078231 申请日期 2006.08.18
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI, DONG HYUN;KIM, YONG WOOK;JANG, CHOL WON;CHOI, YONG HO
分类号 H01L23/34;H01L23/36;H01L23/38 主分类号 H01L23/34
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