发明名称 |
COOLING APPARATUS HAVING AUXILIARY CHILLER AND SEMICONDUCTOR FABRICATING METHOD USING THE SAME |
摘要 |
A cooling apparatus and a method for manufacturing a semiconductor device using the same are provided to keep uniformly the temperature of a wafer chuck in an aiming range by cooling additionally the wafer chuck in case of an abnormal temperature state of the wafer chuck using an auxiliary chiller. A cooling apparatus includes a support unit, a main chiller, a coolant passages and an auxiliary chiller. The support unit is used for loading stably a wafer. The support unit has a cooling room. The main chiller(30) is spaced apart from the support unit. The main chiller includes a main coolant room. The coolant passages are used for connecting the cooling room and the main coolant room with each other. The auxiliary chiller(84) is capable of attaching/detaching to/from the coolant passages.
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申请公布号 |
KR100746231(B1) |
申请公布日期 |
2007.07.30 |
申请号 |
KR20060078231 |
申请日期 |
2006.08.18 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHOI, DONG HYUN;KIM, YONG WOOK;JANG, CHOL WON;CHOI, YONG HO |
分类号 |
H01L23/34;H01L23/36;H01L23/38 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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