发明名称 |
IMPROVED SINGULATION SYSTEM AND METHOD |
摘要 |
<p>A system for singulating an IC unit from a substrate, said IC unit having a combination of linear and non-linear peripheral edges, said system comprising a profile cutting device for cutting the non-linear portions of the IC unit; a longitudinal cutting device for cutting the linear portions of the IC unit, said cutting means located within a singulation zone.</p> |
申请公布号 |
SG133436(A1) |
申请公布日期 |
2007.07.30 |
申请号 |
SG20050082631 |
申请日期 |
2005.12.20 |
申请人 |
ROKKO SYSTEMS PTE LTD |
发明人 |
BAEK, SEUNG HO;JUNG, JONG JAE;SHIN, YUN SUK;SHEN, XUE FANG;LIM, CHONG CHEN GARY |
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