| 摘要 |
A CMP apparatus and a wafer polishing method using the same are provided to reduce remarkably the time necessary for a polishing process by performing simultaneously wafer loading/unloading processes using first and second loading cups. A CMP apparatus includes an index unit, a polishing unit, and a transfer robot. The index unit(100) is used for loading/unloading wafers to/from a cassette. The polishing unit(300) is used for performing a polishing process on the wafers. The transfer robot(200) is installed at a portion between the index unit and the polishing unit to transfer wafers between the index unit and the polishing unit. The polishing unit is composed of a first load cup(310) for loading the wafer transmitted from the index unit, a plurality of platens(320) for polishing sequentially the wafers transmitted from the first load cup, a second load cup(330) for unloading the wafers from the platens, a plurality of polishing heads on the platens, the first load cup and the second load cup, and an abrasive supply member(350) for supplying an abrasive onto polishing pads of the platens.
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