| 摘要 |
An apparatus for processing a rear surface of a substrate is provided to prevent an upper surface of the substrate from being polluted by sucking the upper surface with a vacuum chuck. A substrate(10) is supported by a spin head part(110), and a back nozzle part(140) is installed on the spin head part to spray a liquid onto a rear surface of the substrate. A vacuum chuck(170) is positioned on an upper portion(12) of the substrate to suck the upper surface of the substrate, thereby preventing the upper surface from being polluted. The vacuum chuck is supported by support frames(179).
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